Voltage surge and overvoltage protection

ABSTRACT

Disclosed are various embodiments of voltage protectors that include a first voltage clamping device configured to clamp a voltage of an input power applied to an electrical load, and a second voltage clamping device configured to clamp the voltage applied to the electrical load. A series inductance separates the first and second voltage clamping devices. Also, a switching element is employed to selectively establish a direct coupling of the input power to the electrical load, where a circuit is employed to control the operation of the switching element.

CROSS REFERENCE TO RELATED CASES

This application claims priority to U.S. Provisional Patent ApplicationNo. 60/910,355 entitled “PREVENTING DAMAGE TO TRANSIENT VOLTAGE SURGESUPRESSORS DUE TO OVER VOLTAGES” filed on Apr. 5, 2007 and incorporatedherein by reference in its entirety.

BACKGROUND

Voltage surges created by lightning strikes and longer durationover-voltages experienced on a power distribution grid can result insignificant damage to electronic equipment. Where a sustainedovervoltage is severe, fires have been started resulting in significantloss of property. Existing surge protection devices, such as TransientVoltage Surge Suppressors (TVSS), are typically designed to handle shortduration transients of 8-20 microseconds associated with lightningstrikes. As a result, TVSS devices typically provide no protectionagainst longer duration over-voltage disturbances, and can often be thecause of the fires and damage to equipment that have been reported.

BRIEF DESCRIPTION OF THE DRAWINGS

Many aspects of the present disclosure can be better understood withreference to the following drawings. The components in the drawings arenot necessarily to scale, emphasis instead being placed upon clearlyillustrating the principles of the disclosure. Moreover, in thedrawings, like reference numerals designate corresponding partsthroughout the several views.

FIG. 1 is a schematic of one example of a voltage surge suppressoraccording to various embodiments of the present disclosure;

FIG. 2 is a graph depicting examples of voltage-time curves employed inthe operation of the voltage surge suppressors of FIG. 1 according tovarious embodiments of the present disclosure;

FIG. 3 is a state diagram that provides one example of the operation ofthe voltage surge suppressor of FIG. 1 according to various embodimentsof the present disclosure;

FIG. 4 is a flow chart illustrating one example of a power up routine ofthe voltage surge suppressor of FIG. 1 according to various embodimentsof the present disclosure;

FIGS. 5A and 5B are flow charts illustrating one example of a responseof the voltage surge suppressor of FIG. 1 to a voltage sag according tovarious embodiments of the present disclosure;

FIG. 6 is a flow chart that illustrates one example of a response of thevoltage surge suppressor of FIG. 1 to a moderate overvoltage accordingto various embodiments of the present disclosure;

FIG. 7 is a flow chart that illustrates an example of a response of thevoltage surge suppressor of FIG. 1 to a severe overvoltage according tovarious embodiments of the present disclosure;

FIG. 8 is a schematic of another example of a second transient voltagesurge suppressor according to various embodiments of the presentdisclosure;

FIG. 9 is a state diagram that provides one example of the operation ofthe transient voltage surge suppressor of FIG. 8 according to variousembodiments of the present disclosure;

FIG. 10 is a flow chart illustrating one example of a power up routineof the transient voltage surge suppressor of FIG. 8 according to variousembodiments of the present disclosure;

FIG. 11 is a flow chart that illustrates one example of a response ofthe transient voltage surge suppressor of FIG. 8 to an overvoltage orvoltage sag according to various embodiments of the present disclosure;

FIG. 12 is a flow chart that illustrates one example of a routine thatrestores the transient voltage surge suppressor of FIG. 8 to a nominalstate after an overvoltage or voltage sag in the power voltage has endedaccording to various embodiments of the present disclosure;

FIG. 13 is a schematic block diagram of a processor circuit employed inthe voltage surge suppressors of FIG. 1 or 8 according to variousembodiments of the present disclosure;

FIG. 14 depicts one example of a plot of a line voltage with respect totime that illustrates the timing relating to the insertion and removalof a current limiting impedance in association with the voltage sagaccording to an embodiment of the present disclosure;

FIG. 15 is a schematic of one example of a current limiting circuit thatoperates to time the removal of a current limiting impedance asillustrated, for example, in FIG. 14 according to an embodiment of thepresent disclosure;

FIG. 16 is a schematic of another example of a current limiting circuitthat operates to time the removal of a current limiting impedance asillustrated, for example, in FIG. 14 according to an embodiment of thepresent disclosure;

FIG. 17 is a schematic of yet another example of a current limitingcircuit that operates to time the removal of a current limitingimpedance as illustrated, for example, in FIG. 14 according to anembodiment of the present disclosure;

FIG. 18 is a graph that plots one example of an inrush surge currentwith respect to a duration of a sag in a power voltage such as thevoltage sag illustrated in the example depicted in FIG. 14, where theinrush surge current depicted provides one example basis for determiningwhere the current limiting impedance depicted with respect to FIG. 15,16, or 17 should be removed according to an embodiment of the presentdisclosure;

FIG. 19 is a schematic diagram of one example of a processor circuitthat executes gate drive logic as employed in the current limitingcircuits of FIG. 15, 16, or 17 according to an embodiment of the presentdisclosure; and

FIG. 20 is a flow chart of one example of the gate drive logic executedin the processor of FIG. 18 according to an embodiment of the presentdisclosure.

DETAILED DESCRIPTION

With reference to FIG. 1, shown is one example of a voltage protector100 according to various embodiments of the present disclosure. Thevoltage protector 100 includes an input terminal through which an inputpower voltage V is received. The power voltage V comprises a nominalvoltage that is a standard value, specified for various purposes such aspower distribution on a power grid, i.e. 120/240 single phase, 480/277Wye, 120/208 Wye or other specification. Nominal voltages may begenerated at various frequencies such as 60 Hz., 50 Hz., 400 Hz., or anyother frequency. Thus, a nominal voltage may be an AC voltagesspecified, for example, in terms of peak to peak voltage, RMS voltage,and/or frequency. Also, a nominal voltage may be a DC voltage specifiedin terms of a voltage magnitude.

From time to time, the power voltage V may experience an overvoltagethat may last many milliseconds or even longer. Such overvoltages may becaused by a variety of incidents, including faults in the powerdistribution system or the switching of capacitors into and out of thepower distribution grid for purposes of voltage regulation. Also, insplit 240 volt single phase systems, for example, the loss of theneutral conductor due to a fault, cut conductor, or other problem canresult in overvoltages. Still further, the power voltage V mayexperience voltage sags from time to time, resulting in potentiallyharmful inrush current into sensitive electronic equipment at the end ofthe voltage sag event.

The voltage protector 100 includes phase, neutral, and ground conductorsthat are used to route the power voltage V to an electrical load 103that is coupled to the transient voltage surge suppressor 100. In thisrespect, the voltage protector 100 may be embodied in a power strip, aload center, or other location.

The voltage protector 100 includes a thermal fuse 106 that operates as asafety circuit interrupt as can be appreciated. The voltage protector100 also includes first voltage clamping device 109 and a second voltageclamping device 113. As will be discussed further below, the voltageclamping level of the first voltage clamping device 109 is substantiallyhigher than the voltage clamping level of the second voltage clampingdevice 113. The first voltage clamping device 109 is coupled from phaseφ to neutral N at the power input of the voltage protector 100. Thesecond voltage clamping device 113 is coupled from phase φ to neutral Nat the power output of the voltage protector 100 in parallel with theelectrical load 103 when coupled thereto.

The voltage protector 100 further comprises a series inductance L, afirst switching element R1 and a second switching element R2. The seriesinductance L is positioned in the phase conductor between the first andsecond clamping devices 109 and 113. The first and second switchingelements R1 and R2 are coupled in parallel to each other as shown. Thefirst switching element R1 includes a first state and a second state. Inthe first state, the first switching element R1 couples the seriesinductance L directly to the electrical load 103. In a second state, thefirst switching element R1 couples a shunt resistance R_(S) across thephase φ and neutral N conductors in parallel with the load 103. Wherethe electrical load 103 is inductive, the shunt resistance RS allows theinductive load to discharge and provides a pathway for leakage currentsas can be appreciated.

The second switch element R2 includes a first state and a second state.In the first state, the second switch element R2 couples an impedancebetween the series inductance L and the electrical load 103. In thissense, the second switch element R2 adds an impedance to the electricalload 103. In a second state, the second switch element R2 is open. Thefirst and second switching elements R1 and R2 may comprise, for example,relays, solid state switches such as thyristors, or other types ofswitching circuit elements.

Coupled to the second switching element R2 is an impedance 126 thatcomprises, for example, a negative temperature coefficient resistor(thermistor) or other impedance. In addition, the voltage protector 100includes a voltage clamping device 133 coupled between phase φ andground G, and a voltage clamping device 136 coupled between neutral Nand ground G. The voltage clamping devices 109, 113, 133, and 136 maycomprise, for example, metal oxide varistors, zener diodes, gas tubes,or other voltage clamping circuit elements.

Still further, the voltage protector 100 includes a processor circuit143 that controls the operation of the first and second switchingelements R1 and R2. The voltage protector 100 also includes a currentsurge detection interface circuit 146, a voltage detection interfacecircuit 149, and a power circuit 153. The current surge detectioninterface circuit 146, the voltage detection interface circuit 149, andthe power circuit 153 each receive an input voltage taken across thephase φ and neutral N conductors between the inductance L and the firstand second switches R2.

The current surge detection interface circuit 146 detects whether avoltage sag exists that can result in a potentially damaging currentsurge.

The voltage detection interface circuit 149 detects the power voltage Vand provides an appropriate signal to the processor circuit 143. Byknowing the voltage at any given moment, the processor circuit 143 cantake such action as is deemed necessary to protect components of thevoltage protector 100 and the electrical load 103 from voltage surge andvoltage sag activity as will be described. The current surge detectioninterface circuit 146 and the voltage detection interface circuit 149are designed to provide a fast response to overvoltage and voltage sagconditions. The microprocessor is selected so as to provide for fastswitching of the switching elements R1 and R2.

The power circuit 153 generates DC power that is applied to theprocessor circuit 143 to power its operation as can be appreciated.

Referring next to FIG. 2, shown is a voltage-time chart 163 that depictsseveral voltage-time curves 166 that act as predefined voltage-timethresholds that are used by the processor circuit 143 to control theoperation of the first and second switching elements R1 and R2 (FIG. 1).The data associated with the voltage-time curves 166 is stored in amemory associated with the processor circuit 143.

Each curve 166 represents a magnitude-duration threshold for anovervoltage in the power voltage V (FIG. 1) that is used to determinewhen the processor circuit 143 is to take action to prevent potentialelectrical damage to circuitry due to an overvoltage. This is to say, ifa magnitude of an overvoltage lasts long enough, the amount of energyinherent in the overvoltage may cause damage to circuitry as will bediscussed. The voltage-time curves 166 act as magnitude-durationthresholds by which it may be determined that there is too much energyin an overvoltage to be handled by the first and second voltage clampingdevices 109 and 113.

In this respect, for example, assume that the power voltage V applied tothe voltage protector 100 (FIG. 1) has a nominal value of 120 volts RMSat 60 Hz. According to one embodiment, any overvoltage experienced bythe power voltage V that is less than 15% over the nominal 120 volt RMSvalue is a “safe” value such that the voltage protector 100 continues tosupply the power voltage V to the load 103 through the series inductanceL. However, if the power voltage V is equal to or greater than the 115%of the nominal voltage for a predefined period of time, for example,then the voltage protector 100 may take action to protect the voltageclamping devices 109 and 113, and the electrical load 103 from theovervoltage. In this respect, the voltage clamping devices 109 and 113may conduct current due to the overvoltage, but may become overheated ormay experience other damage causing a fire hazard if the overvoltagemoves beyond the specified voltage-time curves 166.

During operation of the voltage protector 100, the first and secondvoltage clamping devices 109 and 113 operate to dissipate voltagetransients and overvoltages to protect the electrical load 103.Specifically, when a high voltage transient such as caused by alightning strike is experienced in the power voltage V, it firstencounters the first voltage clamping device 109 that begins to conduct.The series inductance slows down the propagation of the voltagetransient or overvoltage to allow the first voltage clamping device 109to clamp the voltage at its clamping level. The second voltage clampingdevice 113 then conducts any excess voltage to ground G that passesthrough the series inductance L. According to one embodiment, since theclamping level (i.e. 300 volts) of the second voltage clamping device113 is approximately one half the clamping level (i.e. 600 volts) of thefirst voltage clamping device 109, then the dissipation of the excessvoltage experienced from a voltage transient or overvoltage isdistributed between the first and second voltage clamping devices 109and 113.

As mentioned above, the voltage clamping level of the first voltageclamping device 109 may comprise, for example, 600 volts, and the secondvoltage clamping device 113 may have a clamping level of 300 volts ascan be appreciated. Alternatively, some other ratio of clamping voltagesmay exist between the first and second voltage clamping devices 109 and113. The specific voltage clamping levels of the first and secondvoltage clamping devices 109 and 113 also depend upon the nominal valueof the power voltage V. It should be noted that even though the clampingvoltage of the first clamping device 109 is 600 volts, the electricalload 103 is never exposed to a voltage that is higher than the clampingvoltage of the second clamping device 113 (i.e. 300 volts). Also, thefirst voltage clamping device 109 affords protection against voltagetransients and the like even if the switching elements R1 and R2 are inan off state.

The processor circuit 143 is configured to control the first and secondswitching elements R1 and R2 to selectively establish a direct couplingof the power voltage V to the electrical load 103. In this respect, whenthe power voltage V experiences an overvoltage that extends beyond oneor more of the voltage-time curves 166, the processor circuit isconfigured to manipulate the switching elements R1 and R2 in order to atleast partially isolate the electrical load 103 and the second voltageclamping device 113 from the power voltage V until the overvoltage hasabated. In one embodiment, the electrical load 103 is entirely decoupledfrom the power voltage V where the switching elements R1 and R2 are inthe off state as will be described.

In this respect, the second voltage clamping device 113 with a lowerconduction voltage dissipates the bulk of the energy in the case ofsustained overvoltage from incoming line to neutral N. Where thedissipation due to the overvoltage is so great that the first or secondvoltage clamping device 109 or 113 may overheat or burn up, the thermalfuse 106 will blow, thereby protecting all of the circuitry in thevoltage protector 100. Other implementations for protecting the voltageclamping devices with thermal fuses are well known and will not bediscussed in greater detail herein.

Thus, the voltage protector 100 advantageously ensures that theelectrical load 103 is protected from voltage transients andovervoltages without presenting a fire hazard. Where the voltageclamping devices 109 and 113 comprise metal oxide varistors, they mayonly last 8 to 10 milliseconds under typically encountered overvoltageconditions while dissipating significant energy before overheating ordamage results. To this end, the design of the voltage protectors asdescribed herein take into account the limited capabilities of suchvoltage clamping devices.

Typical transient voltage surge suppressors do not take such limitationsinto account. For example, even in the rare case where over-voltageprotection is claimed, metal oxide varistors used may be subject toover-voltages for as much as 100-200 milliseconds, which is enough topermanently damage the metal oxide varistors.

Note that the voltage-time curves 166 are specified so as to prevent theprocessor circuit from implementing nuisance switching of the switchingelements 109 and 113 to isolate the electrical load 103 duringovervoltages that may not be high enough to cause damage. In thisrespect, some degree of overvoltage is tolerated in order to preventunwarranted disruption of the operation of the electrical load 103. Suchovervoltages are those that do not result in the overheating of thefirst and second voltage clamping devices 109 and 113, or cause damageto the electrical load 103.

In view of the foregoing, the operation of the voltage protector 100 isdiscussed with greater particularity with reference to the figures thatfollow.

With reference to FIG. 3, shown is a state diagram 173 that depicts theoperation of logic executed within the processor circuit 143 accordingto an embodiment. Alternatively, the state diagram 173 of FIG. 3 may beviewed as depicting steps of a method implemented in the processorcircuit 143.

The state diagram 173 includes a “power off” state 176, a “nominal”state 179, a “voltage sag” state 183, and an “isolation” state 186. The“power off” state 176 is the state of the processor circuit 143 whenthere is no power is applied to the inputs of the processor circuit 143.Assuming that power is applied to the voltage protector 100, then apower up routine 189 is implemented to transition the state of theprocessor circuit 143 from the power off state 176 to the nominal state179. The nominal state 179 represents a normal operating state of theprocessor circuit 143 such that the power voltage V is nominal and novoltage anomalies such as transients or overvoltages are experienced asdescribed above. If power is lost while the processor circuit 143 is inthe nominal state 179, the voltage sag state 183, or the isolation state186, then the processor circuit 143 reverts to the power off state 176.

If, while in the nominal state 179, a voltage sag occurs in the powervoltage V, then a “voltage sag” routine 193 is implemented so as totransition the operation of the processor circuit 143 to the voltage sagstate 183. In the voltage sag state, the processor circuit 143 waitsuntil a voltage sag has come to an end in order to transition back tothe nominal state 179. In transitioning back to the nominal state, theprocessor circuit 143 will implement a “voltage sag over” routine 196.

In addition, if while in the nominal state 179, the voltage protector100 experiences an overvoltage, the processor circuit 143 will decidewhether it is necessary to enter the isolation state 186 depending uponwhether the overvoltage exceeds a given one of the voltage-time curves166 as described above. In some cases, overvoltages may comprisemoderate overvoltages that may not provide immediate harm to theelectrical load 103. However, if the duration of such moderateovervoltages lasts beyond the time specified by a given one of thevoltage-time curves 166, then such moderate overvoltage may becomedamaging due to the excess energy involved. In such case, the processorcircuit 143 transitions to the isolation state 186 by implementing a“moderate overvoltage” routine 199. However, if a severe overvoltageoccurs such that imminent damage to the electrical load 103 and thevoltage clamping devices 109 and 113 may occur, then the processorcircuit 143 will transition from the nominal state 179 to the isolationstate 186 by implementing a “severe overvoltage” routine 203.

When in the isolation state 186, a direct coupling between the inputpower voltage V and the load 103 is disconnected such that theelectrical load 103 is at least partially isolated from the powervoltage V during the duration of the potentially damaging overvoltage.When the moderate or severe overvoltage is over and the power voltage Vhas returned to nominal while in the isolation state 186, then theprocessor circuit 143 returns to the nominal state 179 by implementing a“restore power” routine 206. Examples of the various routines describedabove in transitioning between the respective operational states will beprovided in the discussion that follows. It is understood that each flowchart depicted may be viewed as depicting the operation of the processorcircuit 143, or such flow charts may be viewed as depicting steps ofmethods implemented in the voltage protector 100. In one embodiment, theflow charts depict functionality that may be implemented with any one ofa number of programming languages associated with processor circuitsthat may be employed.

Referring next to FIG. 4, shown is one example of the power up routine189 that occurs upon initial power up of the processor circuit 143 whenthe voltage protector 100 is first placed into an operational state withrespect to an electrical load 103 as can be appreciated. Once the powervoltage V is first applied to the input terminals of the voltageprotector 100, in box 223, the processor circuit 143 is initialized ascan be appreciated. In this initial state, the relays R1 and R2 are inthe off positions (the first state) such that R1 couples the loadthrough the resistor R_(S) to neutral N and R2 presents an open circuit.

By virtue of the fact that the switching elements R1 and R2 are off whenpower is first applied, the electrical load 103 is isolated from thepower voltage V. This is advantageous due to the fact that the powervoltage V may be experiencing an overvoltage while the processor circuit143 is first initializing. Specifically, because the processor circuit143 is initializing when first powered up, it is not in a position tooperate the switching elements R1 and R2 in order to adequately protectthe electrical load 103. Accordingly, the switching elements R1 and R2are specified to be in an off state upon the startup of the voltageprotector 100 so as to protect the electrical load 103 during theinitialization phase.

Next, in box 226, the initialization process proceeds until it hascompleted. Assuming that the processor circuit 143 is initialized, thenbox 227 the processor circuit 143 determines whether the power voltage Vis currently experiencing an overvoltage such as a moderate or severeovervoltage. If no overvoltage is currently being experienced, then theprocessor circuit 143 proceeds to box 229. On the other hand, if anovervoltage exists, then the processor circuit 143 proceeds to box 228in which the processor circuit 143 waits until the voltage has returnedto nominal. Thereafter, the processor circuit 143 proceeds to box 229 asshown.

In box 229 the processor circuit 143 causes the switching element R2 toturn on in order to place the thermistor 126 into the circuit to limitan inrush current into the electrical load 103 during the initial powerup of the load 103. In box 233, the processor circuit 143 initiates atimer. This timer effectively determines a period of time for theelectrical load 103 to fully power up with the thermistor 126 in thecircuit, thereby ensuring that there will be no damaging inrush currentto the electrical load 103.

In box 236, the processor circuit 143 determines whether the timer hasreached a predefined time within which any potential inrush current intothe electrical load 103 will have been abated. Assuming that the timerhas reached the predefined time in box 236, then in box 239, theprocessor circuit 143 turns on switching element R1, thereby directlycoupling the power voltage V to the electrical load 103 and bypassingthe thermistor 126. In this respect, the thermistor 126 is bypassed asthe direct coupling presented through the switching element R1 providesthe path of least resistance to the electrical load 103.

Then, in box 243, the switching element R2 is turned off, therebyopening the circuit. Note that due to the fact that the switchingelement R2 is closed when switching element R1 was turned on, thevoltage seen across switching element R1 at such time will be thevoltage across the thermistor 126. This voltage is relatively low giventhat the thermistor 126 is added in series with the load 103. Where theswitching element R1 is a relay, this fact advantageously prevents asignificant voltage from developing over the contacts of a relay R1,thereby preventing significant sparking during the switching of therelay R1. Such sparking might otherwise result in damage to the relayover time that will significantly degrade its performance and lifespan.Thereafter, the processor circuit 143 enters nominal state 179.

With reference to FIG. 5A, shown is one example of the voltage sagroutine 193 that is implemented in order to transition from the nominalstate 179 to the voltage sag state 183. The voltage sag routine 193 isimplemented when the processor circuit 143 detects a voltage sag in thepower voltage V as described above. The actually magnitude and durationof a voltage sag that causes the implementation of the voltage sagroutine 193 can be predetermined. In one embodiment, the magnitude andduration of such a voltage sag may be specified such that voltage sagsthat are more severe than the predetermined threshold would result in asignificant inrush current into the electrical load 103 when the powervoltage V returns to nominal. However, the threshold voltage sag shouldbe defined so as to prevent nuisance switching, etc. In one embodiment,a voltage sag of less than 75% nominal voltage for more than 2 to 3cycles might result in significant current inrush. In another example, avoltage sage of 85% nominal voltage or higher for a few cycles would beignored as a potential nuisance switching event.

The voltage sag routine 193 begins with box 253 in which the switchingelement R2 is turned on, thereby inserting the thermistor 126 into thecircuit. At some point after R2 is turned on, in box 256, the switchingelement R1 is turned off. This causes the power voltage to be suppliedto the electrical load 123 through the thermistor 126. Assuming that theswitching element R1 is a relay, then by turning the switching elementR2 on before turning the switching element R1 off, the voltage acrossthe contacts of the relay R1 is equal to the voltage across thethermistor 126, thereby minimizing sparking across the contacts of therelay that can degrade the performance and lifespan of the relay asdescribed above.

Thereafter, the voltage sag routine 193 ends and the processor circuit143 is placed in the voltage sag state 183 in which the processorcircuits waits until the voltage sag ends and the power voltage Vreturns to nominal. The level of voltage of the power voltage thatqualifies as the voltage sag that would cause the implementation of thevoltage sag routine 193 may be predetermined as can be appreciated.

With reference then to FIG. 5B, shown is one example of the “voltage sagover” routine 196 that is employed when transitioning from the voltagesag state 183 back to the nominal state 179. The voltage sag overroutine 196 is implemented when the processor circuit 143 detects thatthe power voltage V has returned to a nominal state based upon inputsfrom the voltage detect interface circuit 149 (FIG. 1).

When in the voltage sag state 183, the switching element R2 is in an offstate, where power is supplied to the electrical load 103 through thethermistor 126. Also, the switching element R1 is in an off positionsuch that the electrical load 103 is in parallel with the shuntresistance R_(S).

To begin, in box 263, the voltage sag over routine 196 turns on R1 at anoptimal point in the power voltage cycle. The optimal point in the powercycle is one that minimizes the creation of an inrush current in theelectrical load 103. In particular, reference is made to the discussionof FIGS. 14-20 that mention the timing at which a thyristor or relay iscontrolled to establish the application of power voltage to theelectrical load 103 while minimizing an inrush current to the electricalload 103. Once the switching element R1 is turned on at the optimalpoint in box 263, then the switching element R2 is turned off to allowthe steady state operation of the load 103.

Referring next to FIG. 6, shown is a flowchart that provides one exampleof the moderate overvoltage routine 199 that is executed, for example,to transition the operation of the processor circuit 143 from thenominal state 179 to the isolation state 186 according to variousembodiments. To begin, a moderate overvoltage 199 is detected when anovervoltage experienced in the power voltage V is such that it isgreater than the minimum voltage-time curve 166, but is less than avoltage-time curve 166 that would deem to be immediately damaging to theelectrical load 103 (i.e. a severe overvoltage). As such, moderateovervoltages may exist according for a predefined period of time beforethey are considered damaging. When the moderate overvoltage reaches thepoint where it may be potentially damaging, action may be taken toprotect the various components of the voltage protector 100 and theelectrical load 103 in a manner that minimizes potential damage toswitching elements R1 as will be described.

Beginning with box 273, the moderate overvoltage routine 199 initiates atimer 273. This timer is initiated in order to measure the duration ofthe overvoltage so that it can be compared with a given voltage-timecurve 166 stored in the memory associated with the processor circuit143. In box 273, it is determined whether to decouple the electricalload 103 from the power voltage V based upon whether the moderateovervoltage is greater than one of the given voltage-time curves 166stored in the memory of the processor circuit 143.

Assuming that the electrical load 103 is to be decoupled from the powervoltage V, then in box 279, the relay R2 is turned on, thereby injectingthe thermistor 126 in series with the electrical load 103. Thereafter,in box 283, a delay is imposed upon the operation of the moderateovervoltage routine 199. Then, in box 286, the switching element R1 isswitched off, thereby coupling the shunt resistance R_(S) across facedneutral in parallel with the electrical load 103.

In this situation, the power voltage V is applied to the electrical load103 through the thermistor 126. This is advantageous as the voltageacross the thermistor 126 is a relatively low voltage, which means thatthe voltage across the switching element R1 is equal to such voltagesince the switching element R1 is in parallel with the switching elementR2 and the thermistor 126. If the switching element R1 comprises arelay, then this lower voltage will minimize any sparking experienced atthe contacts of the relay when turned off, thereby preventing majordamage to the relay as described above.

In box 289, a further delay is imposed upon the implementation of themoderate overvoltage routine 199. Then in box 291, the switching elementR2 is turned off, thereby completely decoupling the electrical load 103from the power voltage V. Thereafter, the voltage protector 100 entersthe isolation state 186 in which the electrical load 103 is isolatedfrom the power voltage V until the overvoltage has ended and the powervoltage V has returned to nominal. This action prevents the electricalload 103 from experiencing a potentially damaging overvoltage. Also, thefirst and second voltage clamping devices 109 and 113 are prevented fromoverheating and/or causing a fire, etc. At the same time, where theswitching element R1 is a relay, the lifespan of the relay is extended.

Referring next to FIG. 7, shown is a flowchart that provides one exampleof the operation of the severe overvoltage routine 203 according tovarious embodiments. The severe overvoltage routine 203 transitions theprocessor circuit 143 from the nominal state 179 to the isolation state186 in response to a severe overvoltage experienced in the power voltageV. A severe overvoltage is considered to be an overvoltage that is sohigh that immediate damage is threatened to the electrical load 103and/or the first and second voltage clamping devices 109 and 113. Inthis respect, a severe overvoltage may result in physical damage to thesecond voltage clamping device 113 that may render it inoperative andpotentially cause a fire or other malfunction.

A severe overvoltage may be defined by a predefined voltage-time curve166 stored in a memory associated with the processor circuit 143.Beginning with box 293, the severe overvoltage routine 203 starts atimer. Then in box 296, the severe overvoltage routine 203 determineswhether a severe overvoltage has occurred for a required predefinedperiod of time, thereby necessitating isolation of the electrical load103 from the power voltage V in an attempt to prevent destruction of thesecond voltage clamping device 113, and to protect the electrical load103. Assuming that the duration of the severe overvoltage has reachedthe prescribed time specified in a respective voltage-time curve 166associated with a severe overvoltage, then in box 299, the switchingelement R1 is turned off.

It may be the case where the switching element R1 comprises a relay thata significant spark may occur across the contacts of the relay R1 whenit is turned off in this context since the switching element R2 isturned off at the same time. However, due to the potential damagingnature of the severe overvoltage, the damage that potentially may occurto the relay in this context is tolerated, even if such damage mightresult in undue degradation of the relay R1 and shorten its lifespan.However, given that the occurrences of such severe overvoltages arerelatively rare, the potential damage in this context is toleratedrather than allowing the first and second voltage clamping devices 109and 113 to be overheated or cause a fire, as well as to prevent damageto the electrical load 103. Thereafter, the processor circuit 143 entersthe isolation state 196 in which the electrical load 103 is isolatedfrom the power voltage V.

The restore power routine 206 is implemented to transition the processorcircuit 143 from the isolation state 196 back to the nominal state 179after the power voltage V has returned to nominal, having experiencedeither a severe or moderate overvoltage. In the isolation state 186,both the switching elements R1 and R2 are off. In order to transitionthe processor circuit 143 back to the nominal state 179, the switchingelement R1 is turned on at an optimal point in the power voltage in muchas the way described above with respect to box 263 (FIG. 5B) so as tominimize an inrush current experienced by the electrical load 103.Consequently, the description of the restore power routine 206 is notprovided herein in detail.

Referring next to FIG. 8, shown is a schematic of a voltage protector300 according to another embodiment of the present disclosure. Thevoltage protector 300 is similar to the voltage protector 100 with theexception that the voltage protector 300 does not include the currentsurge detection interface circuit 146 (FIG. 1), the switching element R2(FIG. 1), and the thermistor 126 (FIG. 1). Also, the voltage protector300 includes a processor circuit 303 that executes logic that differsfrom that executed in the processor circuit 143 (FIG. 1). Rather, thevoltage protector 300 includes an R-C snubber comprising a resistance Rand a capacitance C in parallel with the switching element R1 as shown.The R-C snubber comprises a very large impedance that provides asignificant degree of isolation between the power voltage V and theelectrical load 103 when the switching element R1 is off, therebycoupling the shunt resistance R_(S) from phase φ to neutral N.

The operation of the voltage protector 300 is similar to the operationof the voltage protector 100 described above with the exception that theswitching element R2 is eliminated. In this respect, the power circuit143 controls the operation of the switching element R1 in response toovervoltages and voltage sags experienced in the power voltage V. Inparticular, when the switching element R1 is on, the power voltage V isapplied directly to the electrical load 103, where the direct connectionthrough the switching element R1 presents the path of least resistancebypassing the R-C snubber. Thus, the switching element R1 is employed toselectively establish a direct coupling of the power voltage V to theelectrical load 103. An overvoltage is effectively dissipated using thefirst and second voltage clamping devices 109 and 113 as described abovewith respect to the voltage protector 100.

However, when the energy associated with an overvoltage either due tothe high magnitude of the overvoltage or the long duration of theovervoltage reaches a point where the first and second voltage clampingdevices 109 and 113 may be damaged, or where the electrical load 103 mayexperience damage as described above, then the processor circuit 143will turn the switching element R1 off, thereby injecting the R-Csnubber in series between the power voltage V and the electrical load103. Also, the shunt resistance R_(S) is injected in parallel with theelectrical load 103 to prevent high stray voltage from being impressedacross the electrical load 103.

The processor circuit 143 is configured to turn off the switchingelement R1 upon the occurrence of an overvoltage as described above, orupon the occurrence of a voltage sag. When the power voltage V returnsto nominal at the end of an overvoltage, the switching element R1 isturned on to resume normal operation. When the power voltage hasreturned to nominal after a voltage sag, the switching element R1 isturned on at the optimal time during the cycle of the power voltage soas to minimize an inrush current to the electrical load 103 in a similarmanner as was described with reference to FIG. 5 b above.

In view of the foregoing, the operation of the voltage protector 300 isdiscussed with greater particularity with reference to the figures thatfollow.

With reference to FIG. 9, shown is a state diagram that illustrates thecontrol logic 313 implemented in the processor circuit 303 (FIG. 8)according to an embodiment of the present disclosure. Alternatively, thestate diagram of FIG. 9 may be viewed as depicting steps of a methodimplemented in the processor circuit 303. The control logic 313 includesa power off state 323, a nominal state 326, and an isolation state 329.The power off state 323 represents the state of the processor circuit303 when no power voltage V is applied to the voltage protector 300 andthe voltage protector 300 is in an off condition. When the power voltageV is applied to the inputs of the voltage protector 300, then thevoltage protector 300 transitions to the nominal state 326 byimplementing the power up routine 333. Also, when the voltage protector300 reverts to the power off state 323 upon experiencing a loss of power336.

While in the nominal state 326, the voltage protector 300 applies thepower voltage V directly to the electrical load 103 through theinductance L as shown. When voltage transients or overvoltages areexperienced in the power voltage V, the first and second voltageclamping devices 109 and 113 conduct the excess voltage from phase φ toneutral N and limit the ability of such voltage transients orovervoltages from reaching the electrical load 103. The dissipation ofthe voltage transients and overvoltages are distributed among the firstand second voltage clamping devices 109 and 113 as was described abovewith respect to the voltage protector 100. The value of the inductance Lis chosen to control how much current flows through the first voltageclamping device 109, and how the energy dissipation is distributedbetween the first and second voltage clamping devices 109 and 113.

In this respect, the inductance L slows down the speed of voltagetransients and overvoltages to provide time for the first voltageclamping device 109 to dissipate at least part of the excess voltage toneutral N before the second voltage clamping device 113 begins todissipate any remaining excess voltage to neutral N. When the isolationstate 329, the switching element R1 is in the off position and the firstvoltage clamping device 109 dissipates the excess voltage during theduration of the overvoltage or surge. As a result, the second voltageclamping device 113 does not see sustained exposure to the high voltagelevel across the first voltage clamping device 109.

The voltage clamping level of the first voltage clamping device 109 maycomprise, for example, 600 volts, and the second voltage clamping device113 may have a clamping level of 300 volts as can be appreciated.Alternatively, some other ratio of clamping voltages may exist betweenthe first and second voltage clamping devices 109 and 113. The specificvoltage clamping levels of the first and second voltage clamping devices109 and 113 may depend upon the nominal value of the power voltage V.

By virtue of the fact that the second voltage clamping device 103 isisolated from the power voltage when the switching element R1 is in theoff position, the second voltage clamping device 113 is not exposed tothe high voltage surge that is handled by the first voltage clampingdevice 109. This prevents overheating and a potential fire hazard underovervoltage conditions.

Upon detecting an overvoltage or a voltage sag in the nominal state 326,then the control logic 313 implements the overvoltage/voltage sagroutine 339 in which the switching element R1 is turned off totransition the operation of the processor circuit 303 to the isolationstate 329. When the overvoltage or voltage sag condition has abated, thecontrol logic 313 implements the restore power routine 343 to return theoperation of the processor circuit 303 to the nominal state 326.

With reference to FIG. 10, shown is a flowchart that provides oneexample of the power up routine 333 according to one embodiment. Whenpower voltage V is initially applied to the voltage protector 300, theswitching element R1 is in the off position, thereby coupling the shuntresistance R_(S) in parallel with the electrical load 103 and injectingthe resistance R and capacitance C in series with the inductance Lbetween the power voltage and the electrical load 103. This protects theelectrical load 103 from voltage transients and overvoltages until theoperation of the processor circuit 303 of the voltage protector 300 isinitialized.

Starting with box 363, the processor circuit 303 is initialized whilethe switching element R1 remains in an off position. When the processorcircuit 303 is initialized as determined in box 366, the power uproutine 333 proceeds to box 369. In box 369, the switching element R1 isturned on at an optimal point in the cycle of the power voltage V thatminimizes an inrush current to the electrical load 103 in a similarmanner as was described above with reference to box 363 (FIG. 5B).Thereafter, the power up routine 333 ends and the control logic 313enters the nominal state 326.

Referring next to FIG. 11, shown is one example of a flowchart thatprovides one illustration of the “overvoltage/power sag” routine 339that transitions the control logic 313 from the nominal state 326 to theisolation state 329 according to various embodiments. At the time theovervoltage/voltage sag routine 339 is implemented, the switchingelement R1 is in the on state and the power voltage V is directlyapplied to the electrical load 103, thereby bypassing the R-C snubber asdescribed above.

To begin, once an overvoltage or a power sag is detected, then in box373 a timer is initiated to determine the duration of the overvoltage orpower sag to determine whether to turn the switching element R1 off. Theduration and magnitude of the overvoltage may be compared with thevoltage-time curves 166 maintained in a memory of the processor circuit303 to determine whether the switching element R1 should be turned offto protect the electrical load 103 and the second voltage clampingdevice 113. Alternatively, if a power sag is detected, then the durationand magnitude of the sag voltage may be compared against thresholdsstored in the memory to determine whether intervention is necessary tominimize or reduce harmful in-rush current when the power voltage Vreturns to nominal.

If the overvoltage is greater than a respective voltage-time curve 166threshold, or if a voltage sag is deemed severe enough as to result in apotentially harmful in-rush current to the electrical load 103, then inbox 379 the switching element R1 is turned off, thereby placing theimpedance of the RC snubber in series with the electrical load 103.Also, the shunt resistance R_(S) is placed in parallel with theelectrical load 103. In this circumstance, the voltage protector 300 isin the isolation state 329 where the electrical load 103 is protectedand the second voltage clamping device 113 will not overheat.

Referring next to FIG. 12 shown is one example of a flowchart thatprovides one illustration of the “restore power” routine 346 thattransitions the control logic 313 from the isolation state 329 to thenominal state 326 according to various embodiments. In box 383, it isdetermined whether the power voltage V (FIG. 8) has returned to nominal.If so, then in box 386, the switching element R1 is turned on at anoptimal point in the cycle of the power voltage V that minimizes apotential inrush current to the electrical load 103 in a similar manneras was described above with reference to box 363 (FIG. 5B). Note that inthe case of an overvoltage, step 386 may be unnecessary unless thevoltage to the electrical load 103 drops significantly due to thevoltage lost across the RC snubber. Thereafter, the restore powerroutine 343 ends and the control logic 313 is placed in the nominalstate 326.

Referring next to FIG. 13, shown is one example of the processor circuit143 or 303 according to embodiments of the present disclosure. Theprocessor circuit 143/303 comprises, for example, a processor 403 and amemory 406, both of which are coupled to a local interface 409. To thisend, the local interface 409 may comprise, for example, a data bus withan accompanying address/control bus as can be appreciated.

Stored on the memory 406 and executable by the processor 403 are anoperating system 413 and the control logic 173/313. Also, datarepresenting one or more voltage-time curves 166 may be stored in thememory 406 or otherwise may be accessible to the processor circuit143/303.

The memory 406 is defined herein as both volatile and nonvolatile memoryand data storage components. Volatile components are those that do notretain data values upon loss of power. Nonvolatile components are thosethat retain data upon a loss of power. Thus, the memory 406 maycomprise, for example, random access memory (RAM), read-only memory(ROM), hard disk drives, floppy disks accessed via an associated floppydisk drive, compact discs accessed via a compact disc drive, magnetictapes accessed via an appropriate tape drive, and/or other memorycomponents, or a combination of any two or more of these memorycomponents. In addition, the RAM may comprise, for example, staticrandom access memory (SRAM), dynamic random access memory (DRAM), ormagnetic random access memory (MRAM) and other such devices. The ROM maycomprise, for example, a programmable read-only memory (PROM), anerasable programmable read-only memory (EPROM), an electrically erasableprogrammable read-only memory (EEPROM), or other like memory device.

In addition, the processor 403 may represent multiple processors and thememory 406 may represent multiple memories that operate in parallel. Insuch a case, the local interface 409 may be an appropriate network thatfacilitates communication between any two of the multiple processors,between any processor and any one of the memories, or between any two ofthe memories etc. The processor 403 may be of electrical or of someother construction as can be appreciated by those with ordinary skill inthe art.

The operating system 413 is executed to control the allocation and usageof hardware resources such as the memory, processing time and peripheraldevices in the processor circuit 143/303. In this manner, the operatingsystem 413 serves as the foundation on which applications depend as isgenerally known by those with ordinary skill in the art.

Although the control logic 173 and/or 313 are each embodied in softwareor code executed by general purpose hardware as discussed above, as analternative the same may also be embodied in dedicated hardware or acombination of software/general purpose hardware and dedicated hardware.If embodied in dedicated hardware, the control logic 173 or 313 can beimplemented as a circuit or state machine that employs any one of or acombination of a number of technologies. These technologies may include,but are not limited to, discrete logic circuits having logic gates forimplementing various logic functions upon an application of one or moredata signals, application specific integrated circuits havingappropriate logic gates, programmable gate arrays (PGA), fieldprogrammable gate arrays (FPGA), or other components, etc. Suchtechnologies are generally well known by those skilled in the art and,consequently, are not described in detail herein.

The state diagrams and/or flow charts of FIGS. 3-7 and 9-12 thefunctionality and operation of an implementation of the control logic173 and the control logic 313. If embodied in software, each block mayrepresent a module, segment, or portion of code that comprises programinstructions to implement the specified logical function(s). The programinstructions may be embodied in the form of source code that compriseshuman-readable statements written in a programming language or machinecode that comprises numerical instructions recognizable by a suitableexecution system such as a processor in a computer system or othersystem. The machine code may be converted from the source code, etc. Ifembodied in hardware, each block may represent a circuit or a number ofinterconnected circuits to implement the specified logical function(s).

Although the state diagrams and/or flow charts of FIGS. 3-7 and 9-12show a specific order of execution, it is understood that the order ofexecution may differ from that which is depicted. For example, the orderof execution of two or more blocks may be scrambled relative to theorder shown. Also, two or more blocks shown in succession in FIGS. 3-7and 9-12 may be executed concurrently or with partial concurrence. Inaddition, any number of counters, state variables, warning semaphores,or messages might be added to the logical flow described herein, forpurposes of enhanced utility, accounting, performance measurement, orproviding troubleshooting aids, etc. It is understood that all suchvariations are within the scope of the present invention.

Also, where the control logic 173 and/or the control logic 313 comprisessoftware or code, each can be embodied in any computer-readable mediumfor use by or in connection with an instruction execution system suchas, for example, a processor in a computer system or other system. Inthis sense, the logic may comprise, for example, statements includinginstructions and declarations that can be fetched from thecomputer-readable medium and executed by the instruction executionsystem. In the context of the present invention, a “computer-readablemedium” can be any medium that can contain, store, or maintain thecontrol logic 173 and/or the control logic 313 for use by or inconnection with the instruction execution system. The computer readablemedium can comprise any one of many physical media such as, for example,electronic, magnetic, optical, electromagnetic, infrared, orsemiconductor media. More specific examples of a suitablecomputer-readable medium would include, but are not limited to, magnetictapes, magnetic floppy diskettes, magnetic hard drives, or compactdiscs. Also, the computer-readable medium may be a random access memory(RAM) including, for example, static random access memory (SRAM) anddynamic random access memory (DRAM), or magnetic random access memory(MRAM). In addition, the computer-readable medium may be a read-onlymemory (ROM), a programmable read-only memory (PROM), an erasableprogrammable read-only memory (EPROM), an electrically erasableprogrammable read-only memory (EEPROM), or other type of memory device.

The following discussion of FIGS. 14-20 relate to determining theoptimal point in the power cycle at which to establish the directcoupling of the power voltage V to the electrical load 103 so as tominimize an inrush current to the electrical load 103. In particular,the discussion of FIGS. 14-20 describe the control of a thyristor orrelay in order to establish the application of power voltage to theelectrical load 103 while minimizing an inrush current to the electricalload 103. Generally, the timing at which the thyristor or relay aremanipulated to establish the direct coupling applies to the control ofthe switching element R1 as described above with reference to FIGS. 1and 8.

With reference to FIG. 14, shown is a chart that plots a power voltage500 with respect to time to illustrate the various embodiments of thepresent disclosure. The power voltage 500 is applied to a load that maycomprise, for example, an inductive load, a rectifier load, a capacitiveload, or other type of electrical load as can be appreciated. In thecase that the power voltage 500 is applied to a rectifier load, then avoltage is generated across a capacitor associated with the rectifier ascan be appreciated. In this respect, the capacitor facilitates thegeneration of a DC power source in conjunction with the function of thediodes of the rectifier.

With respect to FIG. 14, the capacitor voltage 503 is depicted as the DCvoltage that exists across a capacitor associated with the rectifier.From time to time during the steady state operation of the load to whichthe power voltage 500 is applied, a voltage sag 506 may occur in thepower voltage 500. During a voltage sag 506, the capacitor voltage 503may steadily decrease as the capacitor itself is drained as it suppliescurrent to the electrical load coupled to the rectifier. At the end of avoltage sag 506, it is often the case that the power voltage 500suddenly returns to a nominal voltage 509. The nominal voltage 509 isthe normal operating voltage of the power voltage 500.

Depending where in the power voltage cycle that the power voltage 500returns to the nominal voltage 509, there may be a significant voltagedifferential V_(D) between the power voltage 500 and the capacitorvoltage 503. This voltage differential V_(D) may ultimately result in asignificant inrush current as the load resumes steady state operation.Where the load is a rectifier load, then the inrush current occurs dueto the fact that the rectifier capacitor needs to be charged up andother components that make up the load may pull more current at the endof the voltage sag 506.

The magnitude of the inrush current is affected by various load factorssuch as, for example, the type of load, the condition of load, theproximity of the load with respect to the power voltage 500, powersupply factors, the duration of the voltage sag 506, the line impedance,and the location of any transformer associated with the stepping thepower voltage 500 up or down, and other factors. In addition, themagnitude of any inrush current after the occurrence of a voltage sag506 will depend upon the magnitude of the voltage differential V_(D)that exists at the instant that the power voltage 500 returns to thenominal voltage 509. The nominal voltage 509 is defined herein as anominal value assigned to a circuit or system for the purpose ofconveniently designating its voltage class or type. In this sense,nominal voltage may comprise a standardized voltage specified forvarious purposes such as power distribution on a power grid, i.e.120/240 Delta, 480/277 Wye, 120/208 Wye or other specification.Alternatively, the nominal voltage may comprise a standardized voltagein a closed system such as, for example, a power system on a vehiclesuch as an airplane, etc. A nominal voltage may be, for example, an ACvoltage specified in terms of peak to peak voltage, RMS voltage, and/orfrequency. Also, a nominal voltage may be a DC voltage specified interms of a voltage magnitude.

In order to limit the inrush current at the end of a voltage sag 506,according to various embodiments of the present disclosure, an impedanceis added to the load upon detection of the voltage sag 506 in the powervoltage 500 during the steady state operation of the load. In thisrespect, the power voltage 500 is monitored to detect a voltage sag 506during the steady state operation of the load. Once an occurrence of avoltage sag 506 is detected, the impedance is added to the load.Thereafter, the impedance is removed when the power voltage 500 hasreached a predefined point 513 in the power voltage cycle after thepower voltage 500 has returned to the nominal voltage 509.

The timing of the removal of the impedance from the load after the powervoltage 500 has returned to the nominal voltage 509 is specified to asto minimize an occurrence of an inrush current surge flowing to the loadaccording to various embodiments of the present disclosure. In thisrespect, the removal of the impedance from the load is timed at thepredefined point on the power voltage cycle of the power voltage 500.

In one embodiment, the impedance is removed from the load when the powervoltage 500 is less than a magnitude of the capacitor voltage 503 acrossa capacitor associated with a rectifier, where the load is a rectifierload. In such a scenario, given that the line voltage 500 is rectified,then it can be said that the impedance is removed from the load when theabsolute value of the magnitude of the power voltage 500 is less than amagnitude of the voltage 503 across the capacitor associated with therectifier of the load.

At such time, the respective diodes in the rectifier are reversed biasedwhen the absolute value of the magnitude of the power voltage 500 isless than the magnitude of the voltage 503 across the capacitorassociated with the rectifier of the load. Consequently, there is noinrush current when the absolute value of the magnitude of the powervoltage 500 is less than the magnitude of the voltage 503 across acapacitor associated with a rectifier of the load. Ultimately, in thisscenario, the capacitor associated with the rectifier is charged whenthe normal peaks of the rectified power voltage 500 are applied to thecapacitor, rather than experiencing an instantaneous change in thevoltage as illustrated by the voltage differential V_(D) depicted inFIG. 14.

In an additional alternative, the impedance is removed from the load atapproximately a zero (0) crossing of the power voltage 500 that occursafter the power voltage has returned to the nominal voltage 509 afterthe end of a voltage sag 506. In this respect, to be “approximate” tothe zero crossing, for example, is to be within an acceptable toleranceassociated with the zero crossing such that the magnitude of the powervoltage 500 is unlikely to be greater than a voltage 503 across acapacitor associated with a rectifier of the load.

In another embodiment, the impedance may be removed from the load atapproximately a first one of the many zero crossings that occur afterthe power voltage 500 as returned to the nominal voltage 509. This isadvantageous as the power is returned to the load as soon as possiblebut in a manner that minimizes the possibility that a significant inrushcurrent will occur.

In yet another embodiment, the impedance may be removed from the load ata point on the power voltage cycle that substantially minimizes thedifferential V_(D) between an absolute value of the magnitude of thepower voltage 500 and a magnitude of the voltage 503 across a capacitorassociated with a rectifier of the load. In this respect, if the powervoltage 500 returns to the nominal voltage 509 at a location in thepower voltage cycle such that the magnitude of the power voltage 500 isclose to the voltage 503 across the capacitor so that minimal inrushcurrent may result, then the impedance may be removed potentially evenin a case where the power voltage 500 is on an upswing and is greaterthan the voltage 503 across the capacitor, as long as the voltagedifferential V_(D) is small enough so as to result in an acceptableamount of inrush current to the load.

In such a case, a maximum voltage differential V_(D) may be specifiedthat results in a maximum allowable inrush current that could be appliedto the load, where the impedance would not be removed if the actualvoltage differential V_(D) is greater than the maximum voltagedifferential V_(D) specified. As depicted in the graph of FIG. 14, shownis an embodiment in which the impedance is added to the load during thevoltage sag 506 and is removed at the point 513 in the power voltagecycle that occurs at a first zero crossing after the power voltage 500returns to the nominal voltage 509 according to one embodiment of thepresent disclosure.

With reference next to FIG. 15, shown is a schematic of a currentlimiting circuit according to an embodiment of the present disclosure.The power voltage 500 (FIG. 14) is applied across input nodes 603 asshown. The power voltage 500 may be received from a typical outlet orother power source as can be appreciated. The current limiting circuit600 includes a transient voltage surge suppressor 606 that is coupledacross the input nodes 603. In addition, the current limiting circuit600 includes a zero crossing detector 609, a sag detector 613, and agate drive 616. The power voltage 500 is received as an input into boththe zero crossing detector 609 and the sag detector 613. The output ofthe zero crossing detector 609 comprises a zero crossing signal 619 thatis applied to the gate drive 616.

The output of the sag detector 613 is also applied to the gate drive616. The gate drive 616 controls a thyristor 626 and a relay 629. Inthis respect, the gate drive 616 controls whether the thyristor 626 andthe relay 629 are turned on or off. The relay 629 couples the inputnodes 603 to a load 633. The thyristor 626 couples the input nodes 606to the load 633 through a resister R_(T). In the embodiment depicted inFIG. 15, the input nodes 603 are coupled to the load 633 throughresistor R_(S) that is in parallel with the relay 629 and the thyristor626/resistor R_(T) as shown.

The load 633 as depicted in FIG. 15 comprises a rectifier load having arectifier 636. The rectifier 636 includes the diodes 639 and therectifier capacitor 643. In addition, the load 633 may include othercomponents 646 that receive DC power as can be appreciated.Alternatively, the load 633 may be an inductive load or other type ofload. The zero crossing detector 609, the sag detector 613, and/or thegate drive 616 may be implemented with one or more micro processorcircuits, digital logic circuitry, or analog circuitry as can beappreciated.

Next, a general discussion of the operation of the current limitingcircuit 600 is provided according to one embodiment of the presentdisclosure. To begin, assume the power voltage 500 comprises a nominalvoltage 509 is applied to the load and suddenly experiences a voltagesag 506 (FIG. 14). Assuming that the voltage sag 506 lasts a predefinedthreshold of time where the capacitor voltage 503 (FIG. 14) across thecapacitor 643 drains appreciably, a risk is created of a significantinrush current when the power voltage 500 resumes the nominal voltage509.

During steady state operation of the load, the relay 629 is in a closedposition and the power voltage 500 is applied directly to the load 633through the relay 629. Given that the relay 629 is a direct electricalconnection, it presents the path of least resistance for the currentflowing to the load 633. Consequently, the current bypasses the resistorR_(S). During the steady state operation of the load, the thyristor 626is also in an off state, thereby preventing current from flowing throughthe resistance R_(T). Once the sag detector 613 detects the voltage sag506, then the sag detector output 623 directs the gate drive 616 to openthe relay 629. As a result, the voltage at the input nodes 623 isapplied to the load 633 through the resistor R_(S).

The resistance R_(S) is obviously higher than the near zero resistancepresented by the closed relay 629. By opening the relay 629, theresistor R_(S) is added to the load 633. The resistance R_(S) isspecified so as to limit the current that can flow to the load 633. Thisresistance thus limits any current surge that might occur when thevoltage returns to nominal and the voltage sag 506 has ended, therebyminimizing or eliminating the possibility of damage to electricalcomponents of the load 633 such as diodes 639 in the rectifier 636 orother components.

It should be noted that the resistance R_(S) may also reduce the voltagethat is seen by the load 633 during the voltage sag 506 until either thethyristor 626 is closed (turned on) or the relay 629 is closed. In thisrespect, the resistance R_(S) can exacerbate the reduced voltageexperienced by the load 633 during the voltage sag 506. However, thereduced voltage due to the resistor R_(S) will not be much worse thanwhat can typically be experienced by the load 633 without the resistanceR_(S). This is especially true if the voltage sag 506 lasts for a shorttime. If the voltage sag 506 lasts for relatively long time such thatthe operation of the load is disrupted, chances are any reduction involtage due to the resistance R_(S) would not be of any consequence.

For maximum protection, the current flow through the resistor R_(S)should be low, but as stated above, this might increase the possibilityof momentary interference with the load operation. Thus, the value ofthe resistance R_(S) is determined based upon a trade off betweenprotection in a multi-load environment and the possibility of nuisanceinterference with the operation of the load 633. Experiments show thatthe resistance R_(S) generally does not interfere with the loadoperation for voltage sags of short duration lasting less than five (5)cycles or so.

Once the relay 629 is opened due to the detection of the voltage sag506, then the current limiting circuit 600 stays in such state until thesag detector 613 detects that the voltage sag 506 has ended. Assumingthat the voltage sag 506 has ended, then the sag detector output 623 isappropriately altered. In response, the gate drive 616 does not closethe relay 629 right away. Rather, the relay 629 is maintained in an openstate. The gate drive 616 waits until a signal is received from the zerocrossing detector 609 indicating that a zero crossing has been reachedin the power voltage cycle. The zero crossing output 619 applied to thegate drive 616 indicates the occurrence of all zero crossings.

Upon receiving an indication of a zero crossing after receiving anindication that the voltage sag 506 has ended, the gate drive 616 turnson the thyristor 626 to allow current to flow to the load 623 throughthe thyristor 626 and the resistance R_(T). The resistance R_(T) isspecified to protect the thyristor 626. In particular, the resistanceR_(T) limits the worst case current that flows to the load 633 throughthe thyristor 626 to within the maximum current rating of the thyristor626. Thus, the resistance R_(T) is less than the resistance R_(S) andeffectively allows the nominal power voltage 500 to be applied to theload 633. The thyristor 626 is advantageously employed to cause thepower voltage 500 to be reapplied to the load 633 after the end of thevoltage sag 506 as the thyristor 626 is much faster in operation thanthe relay 629. In this respect, the thyristor 626 can be turned on, forexample, within approximately 10 microseconds as opposed to the relay629 that might take approximately five to ten milliseconds. Because ofthe speed at which the thyristor 626 can operate, the thyristor 626allows the current limiting circuit 600 to control exactly where on thepower voltage cycle that the power voltage 500 is reapplied to the load633.

Alternatively, if the reaction time of the relay 629 in response to achange in the state of the output signal from the gate drive 616 issufficiently fast or can be estimated with sufficient accuracy, then itmay be the case that the relay 629 could be used without the thyristor629. Specifically, the relay 629 could be triggered to close (or turnedoff in the case of a normally closed relay) at a predefined period oftime before a zero crossing is to occur with the anticipation that therelay 629 will actually close on or near the zero crossing itself. Thisembodiment would thus eliminate the need for the thyristor 626 and theresistance R_(T).

Once the thyristor 626 has been on for a necessary amount of time toensure that the capacitor 643 associated with the rectifier 636 ischarged enough to avoid significant inrush current, or that the load 633is operational to the extent that it will not cause an undesirableinrush current, the gate drive 616 closes the relay 629 to reestablishthe conductive pathway between the input nodes 603 and the load 633.Thereafter, the gate drive 616 turns the thyristor 626 off.

Thus, to recap, the thyristor 626 provides the function of supplying thepower voltage 500 to the load 633 after the end of the voltage sag 506.Given that the resistance R_(S) is the impedance that is added to theload 633 during the voltage sag 506, the thyristor 626 acts to removethe impedance R_(S) to resupply the power voltage 500 to the load 633,where the resistance R_(T) is much less than the resistance R_(S).Thereafter, the relay 629 is closed so that a direct conductive pathwayis established to the load 633 without any loss to either of theresistances R_(S) or R_(T).

The current limiting circuit 600 illustrates the operation of anembodiment in which the inrush current that flows to the load 633 isminimized after the end of the voltage sag 506, where the impedancerepresented by the resistance R_(S) that was added to the load 633 isremoved from the load 633 at approximately the zero crossing of thepower voltage 500 after the power voltage 500 has returned to thenominal voltage 509.

The precise zero crossing detected by the zero crossing detector 609 atwhich the thyristor 626 is turned on may be the first zero crossing thatoccurs after the power voltage 500 has returned to the nominal voltage509. Alternatively, the zero crossing at which the thyristor 626 isturned on may be any zero crossing that occurs after the power voltage500 has returned to the nominal voltage 509 with the understanding thatit may be favorable to turn the thyristor 626 on as soon as possible soas to reestablish the power voltage 500 at the load 633 so that the loadis not adversely affected.

In addition, the resistance R_(T) is specified so that the thyristor 626does not experience currents that are too high that may adversely affectits operation, taking into account how long the thyristor 626 would haveto stay on given the zero crossing or other point at which the thyristor626 would be turned on after the voltage sag 506 has ended.

Referring next to FIG. 15, shown is a current limiting circuit 700according to another embodiment of the present disclosure. The currentlimiting circuit 700 is similar in function with respect to the currentlimiting function 600, except that the resistance R_(S) is not employed.In this respect, the impedance added to the load 633 is the equivalentof an infinite resistance or an open circuit. In all other ways, theoperation of the current limiting circuit 700 is the same as describedabove with respect to FIG. 15.

In addition, the current limiting circuit 700 provides additionalcapability in that it can isolate the load 633 from the power voltage500 such as might be desirable in a case where sustained undervoltagesor overvoltages occur that may be dangerous for the load 633. Thecurrent limiting circuit 600 (FIG. 15) may also be configured isolatethe load 633 in the case of an undervoltage or overvoltage that mightpresent a danger for the load 633 by including a second relay in serieswith the resistance R_(S) that would open up to isolate the load 633from the power voltage 500. In case an undervoltage or overvoltage isdetected, a relay may be opened at the same time that the relay 629 isopened.

Turning then to FIG. 17, shown is a current limiting circuit 800according to yet another embodiment of the present disclosure. Thecurrent limiting circuit 800 is similar to the current limiting circuit700 (FIG. 15) with the exception that the zero crossing detector 609 inthe current limiting circuit 700 has been replaced by the impedanceremoval timing circuit 803 that generates an impedance removal signal806 that is applied to the gate drive 616. The current limiting circuit800 operates in much the same way as the current limiting circuit 700with the exception that the impedance removal timing circuit 803receives the voltage across the capacitor 643 of the rectifier 636 as aninput. This voltage may be compared with the power voltage 500 that isreceived as another input.

In this respect, the impedance removal timing circuit 803 may send thesignal to the gate drive 616 to energize the thyristor 626 to supplycurrent to the load 633 when conditions other than zero crossings occurthat will allow the load 633 to be supplied with the line voltagewithout causing an undesirable inrush current surge. In particular, theconditions may comprise, for example, when the absolute value of themagnitude of the power voltage 500 is less than the magnitude of therectified voltage across the capacitor 643 associated with the rectifierof the load. In this respect, the voltage differential V_(D) (FIG. 14)does not exist such that a significant inrush current surge is notlikely to be experienced.

Alternatively, the impedance removal timing circuit 803 may generate theimpedance removal output signal 806 that causes the gate drive 616 toenergize the thyristor 626 to remove the impedance from the load 633 atany point on the power voltage cycle of the power voltage 500 thatsubstantially minimizes a differential between the absolute value of themagnitude of the power voltage 500 and a magnitude of the rectifiedvoltage across the capacitor 643 that is associated with the load.

Referring next to FIG. 18, shown is a chart that plots an example of themagnitude of the peak value of the inrush current surge that flows intoa load as a function of the duration of a voltage sag 506 (FIG. 14) interms of line voltage cycles. As shown in FIG. 18, the peak value of themeasured inrush current surge 809 is depicted for various values ofvoltage sag duration for a typical liquid crystal monitor load. Theinrush current surge 809 has an upper envelope 813, depicting the worstcase stresses that are possible, and a lower envelope 816 that showssignificantly lower inrush current values that may be achieved whennormal load operation is resumed coincident with a line zero voltagecrossing. The upper envelope follows the upper peaks of the inrushcurrent surge 809 and the lower envelope 816 follows the lower peaks ofthe inrush current surge 809.

As can be seen, the peak value of the measured inrush current surge 809potentially increases in time in proportion with the decay, for example,of the voltage experienced across a capacitor 803 (FIGS. 15-17) during avoltage sag 506. Even with the increase of the size of the peaks of theinrush current surge as the duration of the voltage sag 506 increases,there are still significant valleys and lower currents throughout thevoltage sag duration. As such, it is desirable to ensure that the inrushcurrent surge 809 falls at the bottom of a valley of the various peaksshown which generally coincide with the zero crossings of the powervoltage 500 as can be appreciated.

Turning then to FIG. 19, shown is a processor circuit according to anembodiment of the present disclosure that provides one example of animplementation of the gate drive 616 according to an embodiment of thepresent disclosure. As depicted, a processor circuit 820 is shown havinga processor 823 and a memory 826, both of which are coupled to a localinterface 829. The local interface 829 may comprise, for example, a databus with an accompanying control/address bus as can be appreciated bythose with ordinary skill in the art. In this respect, the processorcircuit 820 may comprise any one of a number of different commerciallyavailable processor circuits. Alternatively, the processor circuit 820may be implemented as part of an application specific integrated circuit(ASIC) or may be implemented in some other manner as can be appreciated.It is also possible that the logic control functions can be implementedwithout a microprocessor.

Stored on the memory 831 and executable by the processor 823 is gatedrive logic 831. The gate drive logic 831 is executed to control thefunction of the gate drive 616 in controlling the opening and closing ofthe relay 629, and to turn the thyristor 626 (FIGS. 15-17) on or off. Inaddition, an operating system may also stored on the memory 826 andexecuted by the processor 823 as can be appreciated. Still further,other logic in addition to the gate drive logic 831 may be stored in thememory 826 and executed by the processor 823. For example, logic thatimplements the functions of the zero crossing detector 609 (FIGS. 15 and16), sag detector 603 (FIG. 15, 16, or 17), or the impedance removaltiming circuit 803 (FIG. 17) may be implemented on the processor circuit820 as can be appreciated. Alternatively, separate processor circuitsmay be employed to implement each of the gate drive 616, zero crossingdetector 609, sag detector 603, or the impedance removal timing circuit803.

The gate drive logic 831, zero crossing detector 609, sag detector 603,and/or the impedance removal timing circuit 803 (FIG. 17) is describedas being stored in the memory 826 and are executable by the processor823. The term “executable” as employed herein means a program file thatis in a form that can ultimately be run by the processor 823. Examplesof executable programs may be, for example, a compiled program that canbe translated into machine code in a format that can be loaded into arandom access portion of the memory 826 and run by the processor 823 orsource code that may be expressed in proper format such as object codethat is capable of being loaded into a of random access portion of thememory 826 and executed by the processor 823, etc. An executable programmay be stored in any portion or component of the memory 826 including,for example, random access memory, read-only memory, a hard drive,compact disk (CD), floppy disk, or other memory components.

The memory 826 is defined herein as both volatile and nonvolatile memoryand data storage components. Volatile components are those that do notretain data values upon loss of power. Nonvolatile components are thosethat retain data upon a loss of power. Thus, the memory 826 maycomprise, for example, random access memory (RAM), read-only memory(ROM), hard disk drives, floppy disks accessed via an associated floppydisk drive, compact discs accessed via a compact disc drive, magnetictapes accessed via an appropriate tape drive, and/or other memorycomponents, or a combination of any two or more of these memorycomponents. In addition, the RAM may comprise, for example, staticrandom access memory (SRAM), dynamic random access memory (DRAM), ormagnetic random access memory (MRAM) and other such devices. The ROM maycomprise, for example, a programmable read-only memory (PROM), anerasable programmable read-only memory (EPROM), an electrically erasableprogrammable read-only memory (EEPROM), or other like memory device.

In addition, the processor 823 may represent multiple processors and thememory 826 may represent multiple memories that operate in parallel. Insuch a case, the local interface 829 may be an appropriate network thatfacilitates communication between any two of the multiple processors,between any processor and any one of the memories, or between any two ofthe memories etc. The processor 823 may be of electrical, optical, ormolecular construction, or of some other construction as can beappreciated by those with ordinary skill in the art.

Referring next to FIG. 20, shown is a flow chart that provides oneexample of the operation of the gate drive logic 831 according to anembodiment of the present disclosure. Alternatively, the flow chart ofFIG. 20 may be viewed as depicting steps of an example of a methodimplemented by the processor circuit 820 to prevent an inrush currentsurge to the load 633 (FIGS. 15-17) after a voltage sag 506 (FIG. 14).The functionality of the gate drive logic 831 as depicted by the exampleflow chart of FIG. 20 may be implemented, for example, in an objectoriented design or in some other programming architecture. Assuming thefunctionality is implemented in an object oriented design, then eachblock represents functionality that may be implemented in one or moremethods that are encapsulated in one or more objects. The gate drivelogic 831 may be implemented using any one of a number of programminglanguages as can be appreciated.

Beginning with box 833, the gate drive logic 831 determines whether avoltage sag 506 has been detected. This may be determined by examiningthe output of the sag detector 613 (FIGS. 15-17) as described above.Assuming that a voltage sag 506 has been detected, then in box 836 therelay 629 (FIGS. 15-17) is opened thereby disrupting the flow of currentthrough the relay 629 to the load 633 (FIGS. 15-17). As such, anyreduced current flowing to the load (due to the voltage sag 506) flowsto the load 633 through the resistor R_(S) or does not flow at all as isthe case, for example, with the current limiting circuit 700 (FIG. 15).Next, in box 839, the gate drive logic 831 determines whether the powervoltage 500 (FIG. 14) has returned to a nominal value. This may bedetermined based upon a signal 623 (FIGS. 15-17) received from the sagdetector 613 that indicates that the voltage sag 506 has ended.

Assuming that such is the case, then the gate drive logic 831 proceedsto box 843 in which it is determined whether to apply the power voltage500 (FIG. 14) to the load 633. In this respect, the gate drive logic 831waits for the optimal time to return the power voltage 500 to the loadso as to minimize the potential inrush current to the load 633. Thisdetermination may be made by examining the output from either the zerocrossing detector 609 or the impedance removal timing circuit 803 (FIG.17) as described above. The zero crossing detector 609 or the impedanceremoval timing circuit 803 provide a signal 619 or 806 that indicateswhen the thyristor 626 should be turned on in order to provide currentto the load 633 as described above.

Alternatively, the relay 629 may be turned on in box 846 instead of athyristor 626 where the actual closing of the relay 629 may be timed soas to coincide with a zero crossing or other location on the powervoltage cycle, for example, where the future zero crossing or otherlocation on the power voltage cycle can be predicted given a knownresponse time of the relay 629 itself. As such, the gate drive logic 831would end if the relay 629 is turned on in box 846. However, it shouldbe noted that the relay might be inconsistent in its response time,thereby resulting in variation in when it will actually close and couplethe power voltage 500 to the load 633. Thus, the reduction of any inrushcurrent may be adversely affected to some degree.

However, assuming that the thyristor 626 is turned on in box 846, thenthe gate drive logic 831 proceeds to box 849 to determine whether thesurge current has been avoided. This may be determined by allowing acertain period of time to pass within which it is known that anypotential current surge is likely to be dissipated.

Then, in box 853, the relay 629 is closed, thereby providing power tothe load 633 through the relay 629. Once the relay is closed, then inbox 856 the thyristor 626 is turned off since the load 633 is now beingsupplied through the relay 629. Thereafter the gate drive logic 831 endsas shown.

While the gate drive logic 831, zero crossing detector 609, sag detector603, and/or the impedance removal timing circuit 803 (FIG. 17) may beembodied in software or code executed by general purpose hardware asdiscussed above, as an alternative the same may also be embodied indedicated hardware or a combination of software/general purpose hardwareand dedicated hardware. If embodied in dedicated hardware, the gatedrive logic 831, zero crossing detector 609, sag detector 603, and/orthe impedance removal timing circuit 803 (FIG. 17) can be implemented asa circuit or state machine that employs any one of or a combination of anumber of technologies. These technologies may include, but are notlimited to, discrete logic circuits having logic gates for implementingvarious logic functions upon an application of one or more data signals,application specific integrated circuits having appropriate logic gates,programmable gate arrays (PGA), field programmable gate arrays (FPGA),or other components, etc. Such technologies are generally well known bythose skilled in the art and, consequently, are not described in detailherein.

The flow chart of FIG. 20 shows the architecture, functionality, andoperation of an example implementation of the gate drive logic 831. Ifembodied in software, each block may represent a module, segment, orportion of code that comprises program instructions to implement thespecified logical function(s). The program instructions may be embodiedin the form of source code that comprises human-readable statementswritten in a programming language or machine code that comprisesnumerical instructions recognizable by a suitable execution system suchas a processor in a computer system or other system. The machine codemay be converted from the source code, etc. If embodied in hardware,each block may represent a circuit or a number of interconnectedcircuits to implement the specified logical function(s).

Although flow chart of FIG. 20 shows a specific order of execution, itis understood that the order of execution may differ from that which isdepicted. For example, the order of execution of two or more blocks maybe scrambled relative to the order shown. Also, two or more blocks shownin succession in FIG. 20 may be executed concurrently or with partialconcurrence. In addition, any number of counters, state variables,warning semaphores, or messages might be added to the logical flowdescribed herein, for purposes of enhanced utility, accounting,performance measurement, or providing troubleshooting aids, etc. It isunderstood that all such variations are within the scope of the presentdisclosure.

Also, where the gate drive logic 831, zero crossing detector 609, sagdetector 603, and/or the impedance removal timing circuit 803 (FIG. 17)comprises software or code, each can be embodied in anycomputer-readable medium for use by or in connection with an instructionexecution system such as, for example, a processor in a computer systemor other system. In this sense, the logic may comprise, for example,statements including instructions and declarations that can be fetchedfrom the computer-readable medium and executed by the instructionexecution system. In the context of the present disclosure, a“computer-readable medium” can be any medium that can contain, store, ormaintain the gate drive logic 831, zero crossing detector 609, sagdetector 603, and/or the impedance removal timing circuit 803 (FIG. 17)for use by or in connection with the instruction execution system. Thecomputer readable medium can comprise any one of many physical mediasuch as, for example, electronic, magnetic, optical, electromagnetic,infrared, or semiconductor media. More specific examples of a suitablecomputer-readable medium would include, but are not limited to, magnetictapes, magnetic floppy diskettes, magnetic hard drives, or compactdiscs. Also, the computer-readable medium may be a random access memory(RAM) including, for example, static random access memory (SRAM) anddynamic random access memory (DRAM), or magnetic random access memory(MRAM). In addition, the computer-readable medium may be a read-onlymemory (ROM), a programmable read-only memory (PROM), an erasableprogrammable read-only memory (EPROM), an electrically erasableprogrammable read-only memory (EEPROM), or other type of memory device.

It should be emphasized that the above-described embodiments of thepresent disclosure are merely possible examples of implementations setforth for a clear understanding of the principles of the disclosure.Many variations and modifications may be made to the above-describedembodiment(s) without departing substantially from the spirit andprinciples of the disclosure. All such modifications and variations areintended to be included herein within the scope of this disclosure andprotected by the following claims.

1. A system, comprising: at least one first voltage clamping deviceconfigured to clamp a voltage of an input power applied to an electricalload; at least one second voltage clamping device configured to clampthe voltage applied to the electrical load; a series inductanceseparating the first and second voltage clamping devices; a switchingelement employed to selectively establish a direct coupling of the inputpower to the electrical load; and a circuit that controls the operationof the switching element.
 2. The system of claim 1, wherein the at leastone first voltage clamping device further comprises a metal-oxidevaristor.
 3. The system of claim 1, wherein the at least one secondvoltage clamping device further comprises a metal-oxide varistor.
 4. Thesystem of claim 1, wherein the switching element further comprises arelay.
 5. The system of claim 1, wherein a clamping voltage of the atleast one first voltage clamping device is at least twice as high as aclamping voltage of the at least one second voltage clamping device. 6.The system of claim 1, wherein the switching element further comprises:a first state in which the switching elements establishes the directcoupling of the input power to the electrical load; and a second statein which the direct coupling is opened.
 7. The system of claim 6,further comprising a series impedance coupled in parallel with theswitching element, where the switching element presents a path of leastresistance that bypasses the series impedance when the switching elementis in the first state.
 8. The system of claim 6, where the switchingelement further couples a shunt resistance across the electrical load inthe second state.
 9. The system of claim 6, further comprising animpedance switching element configured to add an impedance to theelectrical load, where the control circuit further controls theoperation of the impedance switching element.
 10. The system of claim 9,where the switching element is in parallel with the impedance switchingelement, where the impedance is configured to minimize a voltage acrossthe switching element when added to the electrical load; and the controlcircuit is configured to sequence a manipulation of the switchingelement and the impedance switching element in order to open the directcoupling so as to minimize a potential for physical damage to theswitching element due to sparking.
 11. A method, comprising the stepsof: applying a power voltage to an electrical load; distributing adissipation of an overvoltage experienced in the power voltage among afirst parallel clamping device and a second parallel clamping device byseparating the first and second parallel clamping devices with a seriesinductance; and establishing a direct coupling of the power voltage tothe electrical load unless a magnitude and a duration of the overvoltageare greater than at least one predefined voltage-time threshold.
 12. Themethod of claim 11, where the at least one predefined voltage-timethreshold further comprises a plurality of predefined voltage-timethresholds, the method further comprising the steps of: storing thepredefined voltage-time thresholds in a memory; monitoring the powervoltage to identify the overvoltage; and timing a duration of theovervoltage.
 13. The method of claim 11, wherein the step ofestablishing the direct coupling of the power voltage to the electricalload unless the magnitude and the duration of the overvoltage aregreater than at least one predefined voltage-time threshold furthercomprises the step of switching an isolation relay from a first state toa second state, where the relay couples the power voltage directly tothe electrical load in the first state, and the relay imposes a shuntresistance across the electrical load in the second state.
 14. Themethod of claim 13, further comprising the step of completely isolatingthe electrical load from the input power when the isolation relay is inthe second state.
 15. The method of claim 13, where the electrical loadis partially isolated from the input power when the isolation relay isin the second state, where the isolation relay is coupled in parallel toan impedance.
 16. The method of claim 11, further comprising the step ofadding an impedance to the electrical load when the power voltageexperiences a voltage sag during a steady-state operation of theelectrical load.
 17. The method of claim 16, where the step of removingthe impedance from the electrical load when the power voltage hasreached a predefined point in the power voltage cycle after the powervoltage has returned to a nominal state.
 18. A system for conditioning apower voltage applied to an electrical load, comprising: means fordistributing a dissipation of an overvoltage experienced in the powervoltage among a first parallel clamping device and a second parallelclamping device; and means for establishing a direct coupling of thepower voltage to the electrical load unless a magnitude and a durationof the overvoltage are greater than at least one predefined voltage-timethreshold.
 19. The system of claim 18, further comprising means foradding an impedance to the electrical load when the power voltageexperiences a voltage sag during a steady-state operation of theelectrical load.
 20. The system of claim 19, further comprising meansfor removing the impedance from the electrical load when the powervoltage has reached a predefined point in the power voltage cycle afterthe power voltage has returned to a nominal state.